| Manufacturing data | |
| Maximum sheet size: | 580*560 mm |
| Maximum testable size: | 580*560 mm |
| Number of layers: | 1 – 48 |
| Track limitations | |
| Minimum solderpiece: | 0.3 mm |
| Minimum finished hole size: | 0.1 mm |
| Minimum track/spacing width: | 75 ym |
| Minimum wire width (InnerLayer) | 0.076 mm |
| Minimum testable SMD gap: | 0.1 mm |
| Minimum testable SMD beach width: | 0.1 mm |
| Metal cover | |||
| Galvanized copper thickness in the bore: | min. 25 um | ||
| Galvanized tin cover thickness: | min. 10 um | ||
| HAL cover thickness: | 8 - 30 um | ||
| Connected gilding: | (nikel) | 5 +/– 2 um | on request: 0.5 – 10 um |
| (gold) | 1 + 1/– 0.2 um | on request: 0.5 – 10 um | |
| Chemical gilding: | (nikel) | 5 +/– 2 um | |
| (gold) | 0.14 +/– 0.04 um | ||
| Board thickness max: | 6.0 mm | ||
| Aspect Ratio | 8:1 | ||
| Impedance Control | ±7% | ||
| Copper Foil | 175 um | ||
| Lacquer covers | ||
| Photosensitive: | 18 – 30 um | |
| Screened of two componets: | green | 10 – 20 um |
| Screened sensitive: | green,black,blue... | 10 – 30 um |
| Position picture colors: | white, yellow, black... | |
| Conductive coal-paste min. line and gap: | 0.5 mm | |
| Removable protective mask thickness: | 0.2 – 0.3 mm | |
| Surface finish | |
| HASL | |
| HAL Lead Free | |
| Panel Gold Plating/ Selective Gold | |
| Immersion Tin | |
| Immersion Gold | |
| Immersion Silver | |
| O.S.P. | |
| BIO | |
| Gold Connectors | |
| Carbon Printing | |
| Peelable Mask | |
| Kapton Tape | |
| VIAs |
| Blind VIAs |
| Burried VIAs |
| VIA filling with silver paste |
| BGA Tehnology |
| Laser Drills |
Published in 2008 with the support of: